Component Fabrication

Equipment includes:

SUSS MA/BA6 Mask Aligner (LED Source): The SUSS MA/BA6 mask aligner provides stable, uniform UV exposure using an LED illumination source with excellent intensity stability and reduced thermal load. The system supports front-side alignment with reproducible alignment accuracy across a range of substrate sizes. LED-based exposure enables consistent dose control and long-term operational stability, making the tool well suited to routine processing and multi-user environments. The system accommodates a wide range of positive and negative photoresists. Typical applications include device definition, alignment-critical layers, and repeatable process flows.

SUSS MJB4 Mask Aligner (Mercury Arc Lamp):  The SUSS MJB4 is a manually operated mask aligner equipped with a broadband mercury arc lamp. The system provides flexible control of exposure and alignment parameters, supporting exploratory lithography and process development. Manual operation allows users to adapt processing conditions for non-standard substrates and novel materials. The MJB4 supports front-side alignment and a wide range of UV-sensitive resists. It is particularly valuable for training, method development, and low-throughput research fabrication.

Photoresist Spin Coaters and Wet Processing Bench: Dedicated photoresist spin-coating systems provide controlled resist thickness and uniformity across wafers and small substrates. Systems support a range of resist viscosities and coating recipes for standard lithographic processes. An integrated wet processing bench enables resist development, lift-off, and rinsing under controlled cleanroom conditions. The separation of coating and wet processing reduces cross-contamination risk. These tools support reproducible lithographic workflows across multiple users and projects.

SCS Parylene Deposition Systems: The SCS parylene systems provide room-temperature, vapour-phase deposition of conformal polymer coatings. The process produces pinhole-free, uniform films over complex three-dimensional topographies. Parylene coatings provide excellent electrical insulation, moisture barriers, and chemical resistance. The systems support multiple parylene variants for application-specific requirements. Typical uses include device encapsulation, passivation, and biocompatible coatings.

Lesker PVD 75 Sputtering System: The Lesker PVD 75 is a versatile electron beam evaporation system used for the deposition of metallic and functional thin films for micro- and nano-fabrication applications. The system provides excellent film thickness uniformity and strong adhesion, supporting the deposition of conductive, barrier, and adhesion layers widely used in device fabrication. Deposition parameters such as film thickness and deposition rate can be precisely controlled, enabling both research and prototype-scale processing. Typical applications include fabrication of electrodes, interconnects, and seed layers for subsequent processing steps. Electron beam evaporation is a line-of-sight deposition technique, producing highly directional material flux with minimal sidewall coverage. This characteristic makes the system particularly suitable for reliable lift-off patterning and high-resolution microfabrication processes.

Moorfield MiniLab T080A Thermal Evaporation System: The Moorfield MiniLab T080A provides thermal evaporation of high-purity metal films. The system enables precise thickness control for thin-film deposition on a variety of substrates. It is well suited to deposition of contacts, adhesion layers, and optical coatings. The system supports lift-off-compatible processes. It is commonly used for rapid prototyping and low-damage metal deposition.

Low-Pressure Plasma System (Femto MFC SLS): The low-pressure plasma system supports plasma cleaning, surface activation, and modification prior to deposition or bonding. Plasma treatments improve adhesion and film quality by removing organic contamination and modifying surface chemistry. The system supports a range of process gases. It is routinely used as a pre-deposition conditioning step. This capability enhances process integration across materials.

Wet Benches and Laminar Flow Sash Hoods: Laminar flow wet benches support chemical etching, surface treatment, and cleaning, including acid-based processing. Benches are equipped with DI water supply and spin-coating capability for rinsing and coating steps. They provide high-cleanliness environments for sensitive substrates. These tools support safe, reproducible wet processing. They complement deposition and lithography workflows.

Oxford Instruments PlasmaPro 80 RIE System: The PlasmaPro 80 provides reactive ion etching (RIE) with controlled anisotropy and well-defined etch profiles. The system supports dry etching of a wide range of materials used in micro- and nanofabrication processes. Process parameters allow tuning of etch rate, selectivity, and sidewall definition, supporting accurate pattern transfer following lithography. The system operates with a maximum RF power of 300 W and supports process development using O₂, SF₆, CF₄, CHF₃, and Ar gases. Typical applications include device definition and microstructuring.

3-Axis Laser Marker (MD-U1020C) wide area UV marking: The MD-U1020C laser marker enables permanent, high-precision marking of samples and devices using a 355 nm ultraviolet (UV) laser. The system provides a marking resolution of 5 µm, supporting fine feature definition for reliable sample identification and alignment referencing. The tool supports traceability throughout fabrication, testing, and characterisation workflows and can be applied to a wide range of materials and substrate sizes. It supports both research and industrial workflows and is commonly used for sample identification and alignment referencing.

Universal Laser VLS2.30 Laser System: The Universal Laser VLS2.30 is a CO₂ laser cutting and engraving system designed for rapid prototyping and precision material processing. The system supports vector cutting, raster engraving, and marking across a wide range of polymers, papers, woods, and coated substrates. Adjustable power, speed, and pulse parameters enable controlled feature definition and repeatable material removal. The enclosed platform and integrated extraction support safe multi-user operation. Typical applications include rapid fabrication of device housings, microfluidic layers, stencils, and alignment fixtures for laboratory workflows.

Pixdro LP50 Inkjet Printer: The Pixdro LP50 is a precision materials inkjet printing platform supporting drop-on-demand deposition of functional inks onto planar substrates. The system enables controlled patterning of conductive, dielectric, and functional materials with programmable droplet placement and layer build-up. Adjustable waveform and jetting parameters support a range of viscosities and particle-loaded inks. Heated platen and substrate handling support uniform film formation and drying. Typical applications include printed electronics, sensor fabrication, and patterned functional coatings for research and prototyping.

Anycubic Mono M7 Pro 3D Printer: The Anycubic Mono M7 Pro is a high-resolution masked stereolithography (MSLA) 3D printer for rapid fabrication of detailed polymer components. Controlled exposure and layer parameters support a range of photopolymer resins, including engineering and castable formulations. The platform is suited to the fabrication of fixtures, microfluidic components, moulds, and prototype devices. Typical use includes rapid iteration of mechanical and structural elements for device development.

Screen Printer: The screen-printer enables the deposition of thick-film pastes and inks onto rigid and flexible substrates through patterned mesh screens. The process supports controlled layer thickness and repeatable pattern transfer across a range of materials, including ceramics, polymers, textiles, and coated substrates. The system accommodates conductive, dielectric, and functional inks for device and sensor fabrication. Screen printing supports both rapid prototyping and small-batch production. Typical applications include printed electrodes, interconnects, and functional coatings for electronic and sensing devices.

Formulation Laboratory: The Formulation Laboratory provides infrastructure for the safe preparation and handling of chemical formulations. The laboratory is equipped with two chemical fume hoods to support controlled handling of volatile or hazardous substances. Safe storage cupboards are available for compliant chemical storage, supporting research and development workflows.